Intel reveals three new cutting edge packaging technologies – Artofit

Image gallery for: Intel reveals three new cutting edge packaging technologies

Intel Reveals Three new Cutting-Edge Packaging Technologies

Intel revealed three new packaging technologies: Co-EMIB stitches multiple Foveros stacks together via EMIB, ODI connects dies, and MDIO is new EMIB interface.
Advertisement
What is Driving Market Growth of MEMS Sensors?

Fact.MR
WORLD’S FIRST 50W SEVEN-DIE LED EMITTER

Gyorsmentések
Sony develops first stacked CMOS image sensor tech with 2-layer transistor pixel

Technology and Research
MetalFX Upscaling will bring DLSS-like image reconstruction to games on MacOS

Technology and Research
Advertisement
Windows 8
Metal foams could provide lightweight radiation shielding

Science
Samsung speeds up development of a new breed of memory that combines RAM and SSD properties

Technology and Research
Mediatek new 600 series SoC

newsgainer
Nvidia G-Sync: the end of screen-tear in PC gaming

Technology and Research
Monster CPU Is 100,000 Times More Powerful Than the Xbox Series X

Technology-Future
Samsung Announces Industry’s First 128GB UFS 2.0 Smartphone Flash Storage

SSDS
Advertisement
Advertisement
Advertisement
This Is the Most Complex Integrated Quantum Circuit Ever Made

Technologeek