Product Description Product Paragon LED Module Model No CBHT-042-36185-120V-3000K COB Holder Model No GPDH66185AC LED Type COB LED Wattage 12W Voltage 120V AC Power Factor PF>0.98 Luminous Intensity 1000 lumens Color Temperature 3000K (Warm White) Dimmable Yes Rendering Index CRI>90 IP Rating IP20 (Indoor rated) COB Holder Dimensions ∅66mm (2.6 in) x H10.15mm (0.4 in) COB Module Outer Diameter ∅31.4 mm (1.2 in) Operating Temperature -40 ~ +105℃ Storage Temperature -40 ~ +105℃ Assembly process Temperature <300℃ Solder joint point <105℃ Dielectric Breakdown Voltage of Thermal Pad >4KV Included Content COB Module, COB LED Holder, Thermal Pad Certifications The CBHT-042-36185-120V-30 Paragon LED Module is a COB LED module designed for indoor use with a power consumption of 12W and a voltage rating of 120V AC. It has a color temperature of 3000K, which produces a soft white light. The module is dimmable and has a high color rendering index of over 90, ensuring that colors are displayed accurately. The module comes with a GPDH66185AC COB LED holder that allows for easy mechanical and electrical connections, as well as secure attachment to a heat sink. The COB holder has dimensions of ∅66mm (2.6 in) x H10.15mm (0.4 in). The outer diameter of the COB module itself is ∅31.4 mm (1.2 in). Features: The CBHT-042-36185-120V-30 Paragon LED Module is a COB LED module designed for indoor use Power consumption of 12W and voltage rating of 120V AC Color temperature of 3000K, producing a soft white light Dimmable with high color rendering index of over 90 Comes with a GPDH66185AC COB LED holder for easy mechanical and electrical connections COB holder dimensions of ∅66mm (2.6 in) x H10.15mm (0.4 in) COB module outer diameter of ∅31.4 mm (1.2 in) Aluminum heat sink recommended to prevent overheating and ensure longevity Silicone grease thermal pad included for additional heat dissipation UL certified and suitable for use in damp locations Operating temperature range of -40 ~ +105℃ and storage temperature range of -40 ~ +105℃ Assembly process temperature should not exceed 300℃ and solder joint point temperature should not exceed 105℃ Dielectric breakdown voltage of thermal pad is greater than 4KV